Vebcon

PCB labels for SMT reflow and wave soldering are typically made of high-temperature polyimide (PI) material that can withstand extreme heat (up to 350∘C350 raised to the composed with power cap C350∘��), corrosive flux, and cleaning agents. These labels are essential for traceability, carrying vital data like serial and lot numbers, which are printed via thermal transfer for legibility through the entire assembly process. 

Labels for SMT reflow PCB assembly, including LCD soldering, should be made of heat-resistant materials like polyimide or polyester, have a suitable acrylic adhesive, and be printed with high-temperature resin ribbons to ensure they remain legible and intact through the reflow process. These high-temperature labels provide traceability for components and printed circuit boards (PCBs) by withstanding the high heat of the SMT reflow oven, and preventing warping, blistering, or adhesive failure.